Metal DfAM eSeries: Above and beyond traditional structures for liquid sooling
Arian Aghababaie, Holo, Inc.
In this presentation, Holo will discuss how to achieve new paradigms of product performance of liquid-cooled devices for high powered chips through design freedom. The validation of designs through the building and testing of novel structures for PC based liquid cooling will be demonstrated.
- Holo’s PureForm technology for printing of high resolution, high conductivity copper
- How to leverage design to improve the fundamentals of heat transfer
- The real-world impact of advances in cooling technology on high-power chips
Ready to try nTop for yourself? Request a demo.