Metal DfAM eSeries: Above and beyond traditional structures for liquid sooling
Published on August 11, 2020
Arian Aghababaie, Holo, Inc.
In this presentation, Holo will discuss how to achieve new paradigms of product performance of liquid-cooled devices for high powered chips through design freedom. The validation of designs through the building and testing of novel structures for PC based liquid cooling will be demonstrated.
- Holo’s PureForm technology for printing of high resolution, high conductivity copper
- How to leverage design to improve the fundamentals of heat transfer
- The real-world impact of advances in cooling technology on high-power chips
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